Intel says 18A process is ready, tape-out confirmed for the first half of 2025

Intel's 18A process, a 2nm class node, aims to regain competitiveness by 2025.

: Intel's 18A process, a 2nm-class node, is anticipated to be ready for tape-out by mid-2025. The node promises a 30% increase in chip density and a 15% improvement in performance per watt compared to Intel 3. Intel’s technology advancements include backside power delivery via PowerVia and RibbonFET, enhancing power efficiency and transistor control. This development is pivotal for Intel, currently facing financial struggles, as it aims to compete with TSMC and Samsung and stabilize its foundry business.

Intel has announced the readiness of its 18A process node, a significant 2nm-class technology, with tape-out design finalizations set for the first half of 2025. This node promises advancements such as a 30% increase in chip density and 15% improvement in performance per watt compared to Intel 3, offering potential competitiveness against sector leaders TSMC and Samsung.

Significant technological innovations accompany the 18A process, including PowerVia for backend power delivery to enhance ISO power performance and RibbonFET, offering improved transistor control against power leakages. These advancements position 18A ahead of TSMC's N2 node, the latter scheduled for volume production in late 2025 and consumer product availability by mid-2026.

Intel's success with the 18A node is crucial amid considerable financial setbacks, with $13 billion losses reported for 2024, highlighting the stakes for their foundry business. As comparisons indicate potential performance benefits over TSMC's N2, a successful implementation of 18A could restore Intel's competitive position and address national concerns over U.S. chip supplies.

Intel 18A semiconductorChip Density