Intel's 18A found to be faster but TSMC's N2 is denser in process node showdown

Intel's 18A is faster, TSMC's N2 is denser, both set to launch significant advances.

: Intel and TSMC are preparing for a competitive launch of their 18A and N2 process nodes. Intel's 18A offers higher performance gains due to PowerVia technology, while TSMC's N2 boasts superior transistor density. Intel is ahead in production timelines, aiming for mid-2025 high-volume manufacturing. The report suggests a closely contested matchup between the two giants.

Intel and TSMC are on the verge of releasing their 18A and N2 process nodes, expanding the landscape of technological advancements. While Intel's 18A promises substantial performance improvements, TSMC's N2 excels in transistor density, offering 313 million transistors per square millimeter, surpassing Intel's 18A and Samsung's SF3.

In terms of efficiency, TSMC's history indicates N2 may have an edge over Intel's 18A, continuing trends of its efficiency leadership. However, Intel's innovative PowerVia technology, not included in all 18A chips, could contribute to enhanced speed and efficiency, setting it apart from TSMC's N2.

Production timeline is another battleground, with Intel set to start high-volume manufacturing of 18A by mid-2025, thus outpacing TSMC, whose N2-based products are expected by mid-2026. This head start means Intel's advanced 18A silicon will hit markets significantly earlier, giving it an initial advantage.

IntelTSMCProcess Nodes