Intel’s next-gen chip manufacturing process reportedly hits snag after failing crucial tests
Intel's 18A chip manufacturing process fails tests with Broadcom, raising concerns about production readiness.
Intel's efforts to regain its former standing in the chipmaking industry have encountered a significant obstacle. Its next-generation manufacturing process, known as 18A, reportedly failed crucial tests conducted by semiconductor developer Broadcom. These tests were part of an evaluation for a potential order using Intel's new process on Broadcom’s silicon wafers.
Broadcom’s unsatisfactory results suggest that Intel's 18A manufacturing technique may not be ready for high-volume production despite the company's assertions to the contrary. Intel remains optimistic, indicating their plans to start high-volume manufacturing next year and highlighting industry interest in 18A. However, Intel's recent financial issues, including $1.6 billion in second-quarter losses and layoffs affecting over 15,000 employees, add to the challenges.
Company CEO Pat Gelsinger is expected to propose further cost-cutting efforts which could include delaying new facilities in Germany and Ohio and potentially selling their Altera business. Intel's ongoing stability problems with its 13th and 14th Gen CPUs, along with these recent setbacks, underscore the difficulties the company faces in regaining its market leadership.