New Samsung 2nm roadmap shows backside power delivery coming in 2027

Samsung unveils a 2nm roadmap featuring backside power delivery set for high-performance computing by 2027 at its Foundry Forum event.

: Samsung revealed a new roadmap at its Foundry Forum event, showcasing 2nm and 1.4nm process technologies. The 2nm SF2Z process, which includes backside power delivery, will be used in high-performance computing by 2027. The company also introduced co-packaged optics and highlighted a surge in AI-related sales.

Samsung unveiled a new roadmap at its Foundry Forum event, focusing on advanced 2nm and 1.4nm process technologies. The highlight is the 2nm SF2Z process, set for mass production in 2027, which features a backside power delivery network eliminating interference issues and voltage drops.

This SF2Z process is designed for high-performance computing (HPC) while other nodes like SF2 and SF2P will target mobile devices. Additionally, Samsung is progressing towards mass production of its 1.4nm SF1.4 process and aims for automotive applications in 2027.

Samsung emphasized its maturity with gate-all-around (GAA) transistors which offer superior performance over FinFET designs. The company also plans to introduce co-packaged optics (CPO) for high-speed data processing, and reported an 80% surge in AI-related sales across various process nodes in the past year.