PlayStation 6 chip design is nearing completion as Sony and AMD partnership forges ahead
Sony and AMD's PlayStation 6 chip design nears completion with Zen 6 3D V-Cache technology.

Sony teams up with AMD for the development of the PlayStation 6, nearing completion with the latest Zen 6 architecture. Manufactured on TSMC's 3nm node, it promises advanced performance for the forthcoming console generation.
The chip design has progressed to the pre-silicon validation phase, and a scheduled A0 tapeout by year-end points to a potential market release in 2027. Consistent with Sony's hardware development cycle, this timeline aligns with previous generations.
Featuring AMD's potential 3D V-Cache technology, the PlayStation 6 aims to boost processing capabilities for both CPU and GPU functions. Despite Intel's interest in the project, AMD successfully secured its position as Sony's chip provider for this new venture.