TSMC plans to begin production of its 1.4nm A14 chip in 2028 and will expand its 3nm family with the introduction of N3P and N3X

TSMC progresses with the 1.4nm A14 chip by 2028, enhancing 3nm line with N3P and N3X.

: TSMC announced the A14 chip production, employing the 1.4nm process, will commence in 2028 and signifies a leap in efficiency. A pivotal feature of the A14 is the innovative NanoFlex Pro transistor architecture, enhancing design flexibility. The production of N3P has already begun as of Q4 2024, while N3X, offering a performance boost, targets mass production later this year. TSMC is allocating $40 billion in capital expenditures for 2025 to bolster its position in advanced semiconductors.

Taiwan Semiconductor Manufacturing Company (TSMC) has announced plans to begin the production of the A14 chip using a 1.4nm manufacturing process by 2028. This development builds on the company’s progressive technological advancements, particularly following the 2nm technology rollout expected within this year. The announcement came during the North American Technology Symposium, where TSMC also revealed its intermediary A16 node, planned for release in late 2026. The A16 will serve as a transitional node toward the A14 process, which is expected to enhance both performance and efficiency significantly, as stated by the world's leading semiconductor foundry.

One of the standout features of the forthcoming A14 generation is the introduction of NanoFlex Pro. This advanced transistor architecture provides chip designers with the ability to precisely tailor configurations to meet specific application needs in terms of power, performance, and area. Although detailed specifics regarding NanoFlex Pro remain undisclosed, it is anticipated to evolve from the current FinFlex architecture. FinFlex allows for the integration of high-performance, low-power, or area-efficient cells within a single module, and NanoFlex Pro might further this flexibility to possibly the transistor level, as described by TSMC representatives.

TSMC's current advancements in the 3nm technology node include the recent initiation of mass production for its third-generation process, N3P, in Q4 2024. N3P is an optical shrink of the N3E process, now powering high-performance chips in sectors such as data centers and advanced consumer technology. Following this, TSMC has slated the N3X to hit volume production in the second half of this year. Kevin Zhang, Deputy COO, mentioned N3X's design focuses on maximizing frequency capabilities, enabling an extra 5% performance gain over N3P, and supporting voltages up to 1.2V. This makes it highly suitable for products like client CPUs and AI accelerators that prioritize speed.

In pursuit of sustaining its competitive advantage, TSMC is committing substantial investments towards the enhancement of its production capabilities. The company has earmarked $40 billion for capital expenditures in 2025, reinforcing its strategy of offering multiple node advancements to prolong the lifecycle of its advanced fabrication plants and customer intellectual property (IP). These efforts aim to fortify TSMC's standing as the premier choice for advanced semiconductor manufacturing, particularly amidst evolving trends where AI chipmakers are increasingly prioritizing the adoption of the latest process technologies.

TSMC's strategic focus and investment in cutting-edge technology signifies not only its dedication to maintaining leadership in the semiconductor industry but also its responsiveness to the semiconductor design shift being fueled by the AI boom. Across the board, TSMC's strategic moves highlight its adaptability and foresight in navigating the complex and fast-paced semiconductor landscape. Kevin Zhang's remarks at the symposium underscored the industry's evolution, where AI and related high-speed applications are now dictating technological advancements and process node innovations.

Sources: TechSpot, North American Technology Symposium

Manufacturing