Tsmc's 2nm chips are nearing production, and the iPhone 18 Pro is likely to be the first to adopt them

TSMC's 2nm chips are nearly ready, targeting iPhone 18 Pro in 2026.

: New reports indicate TSMC's 2nm semiconductors are approaching production, with promising yields highlighting progress. TSMC will start wafer orders on April 1, 2025, and aims for 50,000 wafers weekly by year-end. The iPhone 18 Pro is set to feature the 2nm A20 chip by late 2026, with Apple being the first in line. Other contenders for early 2nm semiconductor adoption include Intel, AMD, Broadcom, and Amazon AWS.

Taiwan Semiconductor Manufacturing Company (TSMC) is nearing the production of its 2nm semiconductors, with very positive yield rates reported. TSMC is a major player in the semiconductor industry, known for its cutting-edge process nodes. The larger context here involves aggressive technological strategies and market competitions, notably between TSMC and rivals like Intel, with TSMC planning to start mass production of the 2nm process later this year. TSMC will begin accepting orders for these wafers on April 1, 2025, targeting a production capacity of 50,000 wafers per week by the end of the year.

Apple is expected to be the first major consumer to utilize TSMC's 2nm semiconductors for the A20 chip in the iPhone 18 Pro, scheduled for release in late 2026. Other prominent tech companies interested in TSMC's advanced node include AMD, Broadcom, Amazon AWS, and notably Intel. Although Intel will be receiving some chips from TSMC, it also aims to compete using its 18A node technology. Intel plans for these chips to debut in its Panther Lake laptop CPUs and Clearwater Forest server processors.

The push into 2nm technology represents a significant milestone as manufacturers strive to pack more transistors into increasingly smaller chips. TSMC has reportedly achieved a 60-70% yield in research and development trials for their 2nm chips, and they have since surpassed this mark, a notable achievement given the complexity of such technology. This development is characterized by the introduction of gate-all-around architectures, which promise to reduce power leakage—an issue growing in tandem with the trend towards miniaturization in semiconductors.

In financial terms, these wafers could potentially cost $30,000 each. This cost factor, combined with the anticipated pricing for Apple's 3nm wafers, suggests that the higher cost of cutting-edge technology might be reflected in consumer prices. Comparatively, 3nm wafers currently cost Apple around $18,000 each, but tariffs might push this figure to $20,000-$23,000, indicating a trend of rising costs in semiconductor manufacturing.

The broader implications of TSMC's advancements are far-reaching, influencing global technology markets and the competitive landscape among semiconductor producers. This progress reflects both the rapid pace of technological advancement in the sector and the growing demand for ever-more efficient and powerful semiconductors, driving companies to innovate aggressively. Such innovations are essential as they underpin a vast range of technologies, from consumer electronics to server infrastructure.

Sources: TechSpot, Commercial Times, Twitter posts by Ming-Chi Kuo, Dan Nystedt

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